What is BGA Assembly?

BGA (Ball grid array) is an advanced packaging technology in SMT PCB assembly. With many ball-shaped bumps on the tube surface, a lot of interconnection points help achieve high-density package purposes. It offers short lead length and ample lead space that is an ideal solution for high-speed PCB products.

What are the features of your BGA assembly services?

Some of the features of our BGA assembly services are - High lead count - No leads to bend - Low inductance - Takes less space on the board - High interconnection density - Low thermal resistance reducing the overheating

What are the benefits of ball grid array assembly?

Ball grid array assemblies are easy and extremely manageable using automated placement machines and also have excellent thermal dissipation capability. BGA packaging is also fit with high-efficiency system products. There is also considerable improvement in both thermal and electrical. Due to the reduction of the unnecessary lead inductance levels, you can achieve better performance at higher speeds. Also since there are no pins that can be bent and broken, the packaging is more stable.

What are the things to consider when selecting a BGA assembly service?

Selecting a ball grid array assembly and manufacturing company is a challenging task in the competitive market. Some of the factors that need to be considered are - Quality - Cost-effectiveness - Customization - Years of experience - Turnaround time - Flexibility & responsiveness - Manufacturing capabilities

What are the types of BGAs?

There are three different types of BGAs - TBGA (tape ball grid array) - PBGA (plastic ball grid array) - CBGA (ceramic ball grid array)

Why choose Mer-Mar Electronics for BGA PCB Assembly?

Mer-Mar Electronics is one of the leading PCB service providers. You can also get the best BGA services from Mer-Mar Electronics. We are also equipped with automated placement networks with visualization techniques for helping with the inspection of solder ball coverage. We have the experience and skills to take care of all your BGA assembly needs. We provide all the BGA assembly services like BGA soldering, BGA reworks, and reballing services at competitive prices.

How do I get started with BGA assembly services?

Drop us a message and our experts begin with reviewing the BGA datasheet and PCB files to create a thermal profile for your BGA assembly. We conduct a detailed design for manufacturability (DFM) review for ensuring the appropriateness and also see that the specialized thermal profile prevents higher temperatures.

What does the BGA rework process comprises of?

Our BGA rework process comprises of the preparing the rework area, component removal, solder paste application, replacement of BGA, and reflow of circuit board. We guarantee to protect your circuit board from further damages.

What is the estimated cost of BGA Assembly services?

Mer-Mar Electronics has been providing BGA assembly services for decades. With cutting-edge equipment, X-ray test equipment, we have been offering high-quality and superior performance. We handle all types of BGAs and comes at competitive costs. You can submit your PCB design files; we will get back to you with the estimated BGA assembly cost.

BGA Assembly – Mermar Electronics

Leading the way for over 40 years

BGA Assembly

Mer-Mar Electronics is a one-stop solution for varied BGA Assembly service like BGA PCB assembly, BGA component removal, BGA replacement, BGA rework & reballing services, circuit pattern design changes at BGA sites, repair of lifted/missing BGA pads, repair of solder mask at the BGA sites. We have extensive experience and knowledge in mounting high-performance devices using Ball Grid Array.

We provide specialized BGA assembly services for testing and inspection purposes as a part of the BGA assembly process as well. We are also capable of handling all types of BGAs and µBGA to large size BGAs. We analyze the BGA sheet, BGA size, ball material composition, and optimize the thermal profile of BGA to enhance the quality and reliability of the assembly process. Get all the solutions for your BGA rework and repair requirements.

We are an ISO certified company with advanced manufacturing and inspection equipment for producing high-quality BGA assembly boards. We have IPC trained employees and adopt triple process inspection for meeting the highest quality standards for Ball Grid Array Assembly requirements. Be assured of all the Ball Grid Array Assemblies manufactured with specialized support, reliability testing, and authorized workmanship. You can get top quality ball grid array printed circuit board assembly from our qualified team of experts.

Get a Quick BGA Assembly Quote

Why Mermar for BGA Assembly Service

1. High-quality

With immense expertise in Ball Grid Array (BGA) assemblies, we have a proven track record in producing high-quality circuit boards with soldering excellence and high-precision component placement.

2. Superior Electrical Performance

We capitalize on the BGA packages’ shorter leads package for ensuring excellent electrical performance on the high-speed circuit boards. Any unwanted signal distortions are also curbed in the high-speed electronics applications.

3. BGA Prototyping Services

We have sophisticated equipment and in-house capabilities to assemble BGA prototyping boards. With recent technologies and staggering 4 decades of experience, we carry out various BGA prototyping board services.

4. Improved Operational Efficiency

We offer BGA rework and repair services and deliver light-weight and compact electronics. Even the badly damaged BGAs can be easily repaired and help regain their operational efficiency and performance.

What Our Customer Says

“It was a very pleasant experience working with Mermar’s representatives…Read More Buyer Testimonial

BUYER, Major Aerospace Components Supplier.

“Overall performance for Mermar is better than expected for a supplier”…Read More Buyer/Spares Manager Testimonial

BUYER/SPARES MANAGER, Major First Responder Electronics Manufacturer.

“Many thanks for another year of superior performance”

OPERATIONS MANAGER,rInternational Aerospace Electronics Company.

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BGA Assembly Capabilities

	Supported Capabilities
Leadless BGAs	Micro Ball Grid Array (µBGA) Thin Chip Array Ball Grid Array (CTBGA) Chip Array Ball Grid Array (CABGA) Very Thin Chip Array Ball Grid Array (CVBGA) Very Fine Pitch Ball Grid Array (VFBGA) Land Grid Array (LGA) Chip scale Package (CSP) Wafer level chip scale packaging (WLCSP)
BGA Assembly Size	2mm x 3mm/1x1mm to 45mm/50x50mm
Passive Footprints	0201, Press fit, 01005, POP, 0603, and 0402.
Pitch Size	Minimum pitch sizes 0.4mm and placement accuracy +/- 0.03 mm
No. of layers	Up to 36
Equipment	automatic placement machines, automated solder dispensing machines, reflow oven, X-ray and AOI inspection systems
BGA Assembly Service Types	Plastic BGA (PBGA) Ceramic BGA (CBGA) Micro BGA Micro Fine Line BGA (MBGA) Stack BGAs Lead BGA and leadless BGA
Testing and Inspection	X-ray inspection for several chip packages. We also provide functional testing and Automated Optical Inspection (AOI).

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BGA Assembly Testing Capabilities

Mer-Mar Electronics is doing its best to make sure you achieve the level of optimization and reliability required. We use Surface Mount Technology (SMT) inspection or BGA inspection to analyze the chip-PCB connections. We constantly monitor various aspects of the assembly using a variety of inspection techniques like

Optical Inspection
Mechanical Inspection
X-ray Inspection

Optical Inspection

We closely view the ball grid array connections with the surface of the PCB using the proper equipment like an endoscope. We have deployed efficient personnel and employed the equipment for optical inspection in the market for assessing the quality of the assembly process.

Mechanical Testing

This is done through shock tests in which the full assembly is subjected to shock. The mechanical properties of the solder joints are evaluated by looking at and measuring the strain.

X-ray Inspection

We have adopted this most advanced method of BGA testing to get a clear picture of the entire process. Under the X-ray test, we see clearly the ball grid image where we visually analyze the connections that usually cannot be optically inspected. We constantly inspect the joints and monitor the quality. We make sure there are no alignment issues and the ball grid array connections are symmetrical.

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BGA PCB Assembly Techniques

Mer-Mar Electronics is capable of ensuring SMT quality and decrease assembly defects. With modern manufacturing methods, we have been providing the SMT assembly process of BGA components for all volume production.

Surface Mount technology

Before we go for the assembly process, we make sure all the components go through the preheat treatment to make sure that they are sensitive to humidity and high temperatures. Before proceeding to the mounting of components, eliminate the moisture. We are skilled in solder paste printing, and solder paste is easily printed on the BGA components. Our engineers are skilled in both horizontal and vertical printing.

BGA SMT Soldering

We mount the components with high precision and even under heavy vibrations, they remain unfazed. We have a specialized SMT assembly line containing chip mounter on & offline AOI equipment, reflow soldering oven, solder paste printer, BGA rework station, etc. We provide a solid foundation for the BGA assembly boards and live up to the customer expectations.

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Applications of BGA Assembly

With BGA assembly providing numerous advantages for high-density PCB products and allows excellent electrical performance and heat conduction.

BGA assembling techniques are quite commonly used in various applications that include

Military airborne
Aerospace
Automotive
Consumer electronics
LED Industry
Wireless & Telecommunications
Flat electronic systems
ICs in Computers, TVs, Phones
Consumer electronics

BGA Assembly FAQs

Are you looking for BGA assembly for your next project? Send us inquiry to Get a Quick BGA PCB Assembly Quote based on your custom requirements.

If you have any queries regarding to our BGA PCB assembly service or need an urgent assistance, then please don’t hesitate to contact our team of skilled personnel’s. Send us an email with your queries at sales@mermarinc.com or call us at (760) 244-6149. We are looking forward to hearing from you.

BGA PCB Assembly