Leading the way for over 40 years
Mer-Mar Electronics Provide BGA assembly, BGA Rework & BGA Reballing services with extensive experience and knowledge. Ball Grid Array is an important type of surface-mount packaging employed in integrated circuit boards. Ball Grid Array essentially used for mounting high-performance devices including microprocessors. BGA assembly Implemented with advanced manufacturing and inspection equipment, we can produce high-quality BGA Assembly Board with excellent proceeds rates.
We are an ISO 9001:2015 certified company since 1999 with IPC trained employees & Triple Processes Inspection, adhering to highest quality standards for Ball Grid Array Assembly requirements. All the Ball Grid Array Assemblies are manufactured with specialized support, reliability testing and authorized workmanship.
BGA soldering, BGA Rework & Reballing
Mer-Mar Electronics provides a specialized BGA soldering service for testing &evaluation purposes as a part of our focus on Prototype PCB Assembly. Additionally, we follow five basic steps to perform BGA rework: component removal, site preparation, solder paste application, BGA replacement, and Reflow Soldering.
Things to Consider when Choosing a BGA Assembly Service!
Choosing a Ball Grid Array Assembly and Manufacturing Company is a very challenging task in this competitive market. Quality and Cost Effectiveness is not only the factors you need to consider. Let’s help you to choose the best Ball Grid Array Assembly Service Provider based on your specifications:
- Service & Manufacturing Capabilities
- Quality Control
- Years of experience
- Turnaround Time
- Flexibility & Responsiveness
- International Delivery
- Value for Money & Time
BGA PCB Assembly
Why Choose Mer-Mar for Ball Grid Array Assembly?
- USA Based PCB fabrication
- ITAR Compliant Manufacturer
- Best On-Time Delivery Record
- No Minimum Order
- Quick Delivery as Fast as 24 Hours
- Competitive Pricing
- Client-Centric Approach
- Guaranteed Quality Satisfaction
BGA PCB Assembly
Benefits of Ball Grid Array Assembly
- Considerable improvement in both thermal and electrical.
- The packaging is more stable because there are no pins that can be bent and broken.
- BGA packaging is fit with high-efficiency system products.
- Ball Grid Array Assembly has excellent thermal dissipation capability.
- Ball Grid Array Assembly is easy & extremely manageable using Automated Placement Machines and more.
Want to Get Your PCB Assembling from Mer-Mar Electronics? Send us an inquiry to Get a Quick Quote based on your custom specifications.
If you have any queries regarding our products or services or need urgent assistance, then please don’t hesitate to contact our team of skilled personnel. Send email with your queries at firstname.lastname@example.org or call us at (760) 244-6149. We are looking forward to hearing from you.
Expert in frame integration projects and offering tailor-made PCB box build and system assembly services with its fully integrated advanced technologies.
We have years of expertise and close relationship with leading component vendors to smoothly handle all aspect of inventory control.